Research internships for international students
UdeS partner internship program

The UdeS partner internship program enables international students from established UdeS partner institutions to carry out 3 to 6 months internships with one of our research teams.
Eligibility
- Any student in a master's program (M1 or M2) or in the 2nd or 3rd year of an engineering school who needs to complete an internship of 3 months or more as part of their studies.
- A GPA equivalent at 12/20 or higher.
- Only students from a partner institution of the Université de Sherbrooke are eligible.
- Check the internship offer for specific eligibility requirements.
- A research community of over 6,500 people
- Over 100 research excellence grants awarded each year
- 6 niches of excellence promoting interdisciplinary research
- 19 research centers
- 105 research chairs, including 2 Canada Excellence Research Chairs
- 2 CNRS international research laboratories, LN2 and Frontières quantiques
- 1 CNRS International Research Centre
- 6 research institutes
- An institutional network of research platforms offering highly specialized shared services and equipment
- An unrivalled training environment for the next generation of scientists
- A support structure for technology transfer
Research internships available
Internships offered to students from UdeS partner institutions for 2026.
In order to maximize your chances of finding an internship that matches your profile, we encourage you to browse all of the categories available. Some offers may be suitable for several fields of study and may not appear in the section you are exploring first.
Electrical engineering and computer science
- 2025-004_Development of MEMS biosensors for early and personalized diagnosis of chronic diseases
- 2025-005_Development of intelligent circuits and sensors with embedded artificial intelligence for biomedical applications
- 2025-008_Large-scale integration of 2D materials for optoelectronic applications
- 2025-009_Development of metrological procedures for quantum sensors
- 2025-010_Development of high-density lateral interconnections (RDL) for heterogeneous integration of large electronic chips
- 2025-011_Optimization of micropillar microfabrication processes for heterogeneous integration
- 2025-012_Nanofabrication of quantum photonic circuits
- 2025-024_Bio-based polymers for microfabrication and assembly of microelectronic devices and systems
- 2025-026_Microfabrication and integration of quantum photonic systems
- 2025-027_Development of R_ELISA prototype for allergen detection
- 2025-028_Surface nanostructuring for high-resolution, high-sensitivity surface plasmon resonance imaging
- 2025-029_Optical characterization of thin layers composed of quantum dots (QD) on metasurfaces
- 2025-030_Study of thermo-optical properties of gold nanostructures array
- 2025_031_Design of plasmonic cavities for strong plasmon-exciton coupling in 2D materials
- 2025-035_Millimeter-wave amplifier operating at the quantum limit
- 2025-036_Non-reciprocal superconducting circuits based on Josephson photonics
- 2025-037_Counting quasiparticles in a superconductor for dark matter research
- 2025-043_Development of materials for the manufacture of quantum devices
- 2025-047_Implémentation de réseaux de neurones à décharges (SNN) sur circuits FPGA
- 2025-049_Synthesis and characterization of thin films for infrared microbolometers
Robotic engineering
- 2025-016_Robotics and AI for mapping complex environments
- 2025-020_Development of human-robot interaction strategies for collaborative object manipulation
- 2025-021_Visualization and exploration of configuration spaces for robot motion planning
Mechanical engineering
- 2025-017_Design, modeling, and signal processing for echography
- 2025-019_Waste heat recovery from data centers for sustainable energy efficiency
- 2025-041_Collecting data on air and noise pollution by bicycle
- 2025-042_Use of Chladni's direct and inverse figures for sorting materials
- 2025-049_Synthesis and characterization of thin films for infrared microbolometers
Civil engineering
Chemical engineering
- 2025-009_Development of metrological procedures for quantum sensors
- 2025-010_Development of high-density lateral interconnections (RDL) for heterogeneous integration of large electronic chips
- 2025-011_Optimization of micropillar microfabrication processes for heterogeneous integration
- 2025-012_Nanofabrication of quantum photonic circuits
- 2025-013_Development of a molding process for the heterogeneous integration of large electronic chips
- 2025-034_Development of processes for recovering asbestos-contaminated mining residues in Quebec
- 2025-049_Synthesis and characterization of thin films for infrared microbolometers
Physics
- 2025-009_Development of metrological procedures for quantum sensors
- 2025-010_Development of high-density lateral interconnections (RDL) for heterogeneous integration of large electronic chips
- 2025-011_Optimization of micropillar microfabrication processes for heterogeneous integration
- 2025-012_Nanofabrication of quantum photonic circuits
- 2025-038_Quantum hybrid systems
- 2025-049_Synthesis and characterization of thin films for infrared microbolometers
Materials science and nanoscience
- 2025-009_Development of metrological procedures for quantum sensors
- 2025-010_Development of high-density lateral interconnections (RDL) for heterogeneous integration of large electronic chips
- 2025-011_Optimization of micropillar microfabrication processes for heterogeneous integration
- 2025-012_Nanofabrication of quantum photonic circuits
- 2025-013_Development of a molding process for the heterogeneous integration of large electronic chips
- 2025-049_Synthesis and characterization of thin films for infrared microbolometers
Chimie
- 2025-009_Development of metrological procedures for quantum sensors
- 2025-010_Development of high-density lateral interconnections (RDL) for heterogeneous integration of large electronic chips
- 2025-011_Optimization of micropillar microfabrication processes for heterogeneous integration
- 2025-012_Nanofabrication of quantum photonic circuits
How to apply ?
- Select the internship offers that interest you (maximum 3 offers)
- Prepare the required documents (one application per internship offer, files in pdf format):
- Covering letter
- Curriculum vitae
- Transcripts: all available transcripts from higher education (after the baccalauréat)
- One or two letters of reference if possible
- Fill in the application form
- Send the required documents to Udes.Francophonie@usherbrooke.ca, indicating the internship offer reference number and title in the subject of the email.
- Deadline for sending your documents: September 29th, 2025
- Students from UdeS partner institutions consult the internship offers and can apply for one or more of them.
- Applications are reviewed and, in some cases, preliminary interviews may be held.
- Applications that meet the eligibility and quality criteria (grade point average, skills related to the field, motivation) are forwarded to the professors.
- The professors review the applications, conduct interviews and make their selection.
- The results are communicated to those who applied, and the students then send their response (acceptance or rejection of the internship).
- With the support of USherbrooke International, candidates selected for an internship complete their temporary immigration application online (work permit application).
- Start dates for internships at the Université de Sherbrooke are flexible.
Do you have questions ?
For general questions about research internships, visit the USherbrooke International website.
You can write to UdeS.Francophonie@USherbrooke.ca if you have specific questions about the UdeS partner internship program.