Mask aligner OAI 806 MBA

Description

UV exposure instrument for photolithographic masks with frontend substrate alignment and possibility of backend alignment

3 modes : hard contact, N2 hard contact and Vacuum contact

Manufacturer and model

OAI- Optical Associates Inc. -806 MBA

Technical specifications

• Resolution 0.8 μm
• UV lamp 350W emitting at wavelengths between 220 nm and 436 nm
• Maximum substrate diameter: 6 in
• Maximum dimensions of masks: 7 x 7 squares
• Compatible with the use of small samples and masks 4 x 4 and 5 x 5

Examples of available processes

• Exposition of various resins (Shipley, AZ, SU8, Futurrex, dry film, etc.) according to predefined patterns for carrying out:
  • Semiconductor microstructures (on Si, III-V compounds, etc.) and metal microstructures
  • Implantation masks
  • Engraving masks
  • Lifting masks
  • Plating masks
  • Permanent component for waveguides or microfluidic channels