Mask aligner OAI 200

Description

UV exposure instrument for photolithographic masks with front end substrate alignment

2 modes : hard contact and vacuum contact.

Manufacturer and model

OAI - Optical Associates Inc. -OAI 200

Technical specifications

• Resolution 0.8 μm
• UV lamp 200W emitting at wavelengths between 220 nm and 436 nm
• Maximum substrate diameter: 3 in
• Maximum dimensions of masks: 4 x 4 squares
• Compatible with the use of small samples

Examples of available processes

• Exposition of various resins (Shipley, AZ, SU8, Futurrex, dry film, etc.) according to predefined patterns for carrying out:
  • Semiconductor microstructures (on Si, III-V compounds, etc.) and metal microstructures
  • Implantation masks
  • Engraving masks
  • Lifting masks
  • Plating masks
  • Permanent component for waveguides or microfluidic channels