NORDSON DAGE 4000Plus
The Nordson DAGE 4000Plus can perform pull/push test and shear test for micro-cables (wire bond) and flip chips. The results obtained by the Nordson DAGE 4000Plus are displayed using profile, histogram, trend, Pareto and statistics.
Specifications
| Parameter | Value |
|---|---|
Size of the sample held by the vice | 10 mm à 100 mm |
XY table dimensions | 160 mm x 160 mm |
Pull cartridge | Pushes up to 50 kg load Pull up to 100 kg load |
Shear cartridge | Ball shears Shear force up to 200 kg Speed : up to 50 mm/sec |
Several cartridges available on request. Contact the team at infoLCP@Usherbrooke.ca | |
| Machine precision | |
Full sys accuracy using loading cartridges | ± 0.1 % deflection |
Accuracy of cartridge recoil in shear, excluding the S25 cartridge | ± 1 µm over 2 mm ont the Z axis |
Cartridge Recoil Accuracy S25 | ± 0.25 µm over 2 mm ont the Z axis |
Possible tests
| Pull tests | Shear Test |
|---|---|
Wire | Ball |
| Ribbon | Solder ball |
| Hot bump/pin pull | Standard die shear |
| Copper wire bonds, studs and pillars | Cavity |
| Stud bump | Passivation layer |
| Vector | Low profile zone shear |
| Fatigue | Wafer bump |
| Push | Fatigue |
| Tweezer peel | Low profile die shear |
| High force pull (up to 100 kg) | High force die shear |
| Vertical stud pull | Horizontal stud pull |
| Die pull/flip chip pull | Cu pillar shear |
| Cold bump pull | Micro bump shear |
Meets the following industry standards:
| Cold bump pull/Hot bump pull | EITA EIAJ ET-7407/IPC-9708 |
| BGA bump shear | JEDEC JESD22-B117A |
| Cold bump pull | JEDEC JESD22-B115 |
| Au ball shear | JEDEC JESD22-B116 |
| Ball bond shear | ASTM F1269 |
| Wire pull | DT/NDT MIL STD 883 |
| Stud pull | MIL STD 883 |
| Flip chip pull | JEDEC JESD22-B109 |