Chemical Mechanical Planarization - CMP

Description

Polishing and planarization tool for insulating, semiconducting or metallic thin films.

Manufacturer and model

Alpsitec - E460

Technical specifications

• Thicknesses of films from 20 nm to 2 μm
• Support for 4 wafer, square samples of 10 x 10 and 22 x 22 mm2
• Acidic, basic or neutral polishing solutions with silica, alumina, or cerium

Examples of available processes

• Planarization of nanometric junctions for the manufacture of nanoelectronic devices of RRAM, SET, MIM type
• Planarization of metallic nanowires
• Polishing of Si₃N₄, SiO₂ to reduce surface roughness
• Planarization of gold microstructures