Semi-automatic wirebonding system for electrical connections between chip and substrate through large aluminum or copper wire or tape for power electronics.
21 cm x 26 cm
Heated work stand
Diameter of 90 mm
Maintaining samples mechanically
Type of bonding
Round wire Al, Cu : 100 to 500 µm
Ribbon Al, Cu : max. 300 µm x 2000 µm
0 to 50 watt
Programmable bonding time
0 to 10 sec.
Programmable bonding force
50 – 1800 cN
Number of programs that can be recorded