TPT HB30
Semi-automatic wirebonding system for electrical connections between chip and substrate through large aluminum or copper wire or tape for power electronics.
Specifications
| Parameter | Value | Note |
|---|---|---|
Work plate | 21 cm x 26 cm | |
Heated work stand | Diameter of 90 mm | Adjustable height Maintaining samples mechanically |
Type of bonding | Wedge bonding Round wire Al, Cu : 100 to 500 µm Ribbon bonding Ribbon Al, Cu : max. 300 µm x 2000 µm | |
Reels | 5 in |
|
Transducer frequency | 60 kHz |
|
Ultrasonic power | 0 to 50 watt |
|
Programmable bonding time | 0 to 10 sec. |
|
Programmable bonding force | 50 – 1800 cN |
|
Number of programs that can be recorded | 100 |
|