DIENER PlasmaBeam

The PlasmaBeam is used for ultra-fine cleaning and activation of reactive particles (radicals) contained in the active gas jet during the reaction. In addition, free and adhering particles are removed from the surface by the active gas jet accelerated by compressed air.

The PlasmaBeam is also suitable as a pretreatment device for the following processes:

• Collage
• Impression
• Lamination
• Welding

The following surfaces can be treated:

• Plastic
• Metal
• Glass
• Ceramic
• Hybrid materials

The active gas jet from the plasma nozzle is always free of dangerous voltage potential. The voltage is so low that it can barely be measured. This allows the device to be used for different processes in the electronics industry, for example:

• Cleaning the connection pads before wire bonding
• Cleaning and activating LCD contacts before “heat sealing”
• Activating chip surfaces before printing
• Activation of dwellings containing electronic installations

The following are important for good surface treatment with PlasmaBeam:

• Treatment should always be carried out while moving.
• The processing speed (v = 100 to 1000 mm/s) and the distance between the plasma nozzle and the surface to be treated (d) are the most important parameters for achieving the desired surface properties. Changing these settings can drastically change the effect of the preprocessing.