Aller au contenu

Equipments

Discover the services and equipment offered by the 3IT.Materials platform.

Provided Services

  • High-resolution imaging (SEM & TEM)
  • Crystallographic analysis (diffraction, orientation, phases)
  • Elemental and phase chemical analysis (quantification, mapping)
  • Detailed analysis reports (illustrations, interpretation, recommendations)

  • Instrument usage (sample preparation, optimal settings, safety, etc.)
  • Results analysis (image processing, interpretation, dedicated software, etc.)

  • Methodological guidance based on the material and its intended function
  • Development of specific protocols tailored to the process, application, or needs
  • Data analysis and interpretation

Our services are relevant across multiple sectors:

  • Fundamental and applied research (universities, industrial laboratories)
  • Microelectronics (layer quality, defects, assemblies, etc.)
  • Nanotechnologies (size, dispersion, substrates, etc.)
  • Quantum & advanced materials (topological interfaces, superconductors, etc.)
  • Quality control (powders, coatings, critical interfaces, failure analysis, etc.)
  • Device development (sensors, MEMS, prototypes, etc.)
  • Energy and environment (catalysts, corrosion, contamination, surface reactions)

Equipments

Surface morphology observation, high-resolution imaging, chemical analysis (EDS), ion beam milling, and slice-and-view tomography

  • SCIOS 2 SEM-FIB ThermoFisher – Canon FEG Schottky
  • Detectors and spectrometer
  • Secondary electrons (E-T): surface and topography imaging
  • Filtered secondary electrons (in-lens): enhanced surface detail
  • Backscattered electrons: compositional contrast
  • Segmented annular transmission detector: for thin materials
  • X-ray spectroscopy (EDS): elemental composition and mapping

Visualization down to the atomic scale, electron diffraction, chemical mapping (EDS, EELS)

  • Spectra 200 ThermoFisher – Cold-FEG Schottky source with spherical aberration correction
    Resolution: < ~60 pm
  • Sample holders
  • Single-axis rotation
  • Dual-axis rotation
  • Tomographic (+/- 70°)
  • In situ (up to 1 atm and 1000°C, with or without applied electrical bias via microelectrodes)
  • Detectors, camera, and spectrometers
  • 4K Falcon camera (for imaging or diffraction modes)
  • 4 surrounding EDX spectrometers for elemental analysis
  • Electron energy loss spectroscopy (EELS) camera: K2-GIF Continuum
  • Segmented transmission detectors for differential contrast imaging (bright field, dark field, annular, high-angle annular)

  • Cutting and polishing
  • Electro-jet polishing
  • Chemical fume hood
  • Binocular microscope and inverted optical microscope

  • Dragonfly™ (Comet): platform for image analysis and 3D structure visualization
  • Digital Micrograph, VELOX: software for hyperspectral data analysis

These tools enable the analysis of:

  • Morphology (particle size, shape, distribution, internal porosity, interfaces, etc.)
  • 3D analyses are possible through tomography: either via FIB slicing in SEM-FIB or using a tomographic sample holder in TEM.
  • Crystalline structure (crystal lattice, grain orientation, interface coherence, defects, etc.)
  • In TEM via electron diffraction or direct atomic contrast imaging.
  • Chemical composition (elemental mapping, quantification, point analysis, multiphase analysis, etc.)
  • In SEM-FIB via X-ray spectroscopy (EDS).
  • In TEM via both X-ray spectroscopy (EDS) and electron energy loss spectroscopy (EELS).
  • Chemical tomography is also possible but requires significant acquisition and analysis time.
  • Micro/nanostructure evolution under reactive conditions
  • Observation of oxidation and reduction phenomena in controlled atmospheres (e.g., 5% O₂ or H₂ in an inert carrier gas such as N₂ or He), up to 1000°C.
  • Near-instantaneous temperature ramping.
  • Microstructure evolution during simulated thermal treatments and/or under applied electrical bias.
  • Microscale cutting and micromanipulation
  • Ion beam etching or cutting, micromanipulator in FIB to observe subsurface or covered structures.
  • Volume extraction of a few µm³.
  • Preparation of thin electron-transparent lamellae for TEM analysis.