CALTEX RX-100-BGA
With the innovative 3D rotation view, in addition to the 90° observation mirror for BGA/QFP, this device offers unprecedented BGA inspection capability. Quality control and defect analysis is easily done using the camera and tools. The system is easy to use and extremely robust for a production environment. Real-time view of inspection, image capture of defects for documentation and measurement of the size of the balls of a BGA.
- Weld checks
- Variable working distance
- 360° angle view (30°)
- High Resolution 2MP SONY CCD Color Camera
- 3x magnification à 100x
- Complete software for image processing
Applications
- SMT Weld Inspection
- Inspection of the BGA
- Inspection of the inside of Thru-holes
- Inspection and documentation of metal, plastic and other parts
- Failure analysis
Specifications
| Parameter | Value |
|---|---|
Zoom Magnification | 15x-100x |
Zoom Ratio | 1:6.5 |
Field of view | 2.4 mm à 100x jusqu'à 16 mm à 15X |
Angle of view | 0° direct view and 20° angular view |
Working distance - direct view | (15-100x) : 103 mm |
Working distance - angular view 30° | (15-100x) : 45 mm |
Measurement accuracy (software) | 10µ à 15x, 1.6µ à 100x |
Examples of uses
Solder paste inspection
Fine Pitch Component Inspection
Using the Mirror for BGA Inspection
J-Lead welding inspection
Photo of chip
(here: Photo ASIC ICFSHFE3 (4.56mm x 5.887 mm))