Tegal Corporation Oxygen Plasma Cleaning System - Plasmaline 415

Description

Sample cleaning by oxygen plasma

Manufacturer & model

Tegal Corporation - Plasmaline 415 

Technical specifications

• Barrel Etcher Style Chamber
• RF source 0 to 300W at 13.56 MHz
• Maximum substrate diameter 6”
• Compatible with the use of small samples

Examples of available processes

• Cleaning before engraving
• Cleaning before metal deposit
• Elimination of organic residues (resins, etc.)