GnP Technology Axus 412S wafer cleaning system
Description
Cleaning of wafers after chemical/mechanical polishing
Manufacturer & model
GnP Technology Axus 412S
Technical specifications
- Cleaning of slices from 100mm to 300mm
- Cleaning: DI water, ultrasonic and NH4OH solution
- Double brush system for simultaneous cleaning on top and below the edge
- Slice rotation up to 2000rpm during cleaning or drying
- Nitrogen drying