CMP Alpsitec E460 mechanical-chemical polishing

Description

Polishing system

Manufacturer and model

Alpsitec E460

Technical specifications

• Polishing and planarization tool for thin insulating, semiconductor or metallic films
• Film thicknesses from 20 nm to 2 µm
• Support for wafer 4, square samples of 10 x 10 and 22 x 22 mm2
• Acidic, basic or neutral polishing solutions with silica, alumina, or cerium

Examples of available processes

• Planarization of nanometric junctions for the fabrication of nanoelectronic devices such as RRAM, SET, MIM
• Planarization of metal nanowires
• Polishing of Si3N4, SiO2 to reduce surface roughness
• Planarization of gold microstructures