Expertus

Danovitch, David

Professeur sous octroi de recherche, Faculté de génie

FAC. GÉNIE Électrique et informatique

Coordonnées

819-821-8000, poste 62129

david.danovitch@usherbrooke.ca

Langues parlées et écrites

Anglais, Français

Formation

Master's Thesis,  Masters of Engineering,  McGill University (1982)

Bachelor's,  Bachelor's of Engineering,  McGill University (1980)

Profil

Sujets de recherche

Micro and Nanoelectronics.

Intérêts de recherche

Microelectronics packaging, materials for interconnections and encapsulations

Disciplines de recherche

Electrical Engineering and Electronic Engineering, Material Engineering and Metallurgic Engineering.

Mots-clés

microelectronics packaging, flip chip soldering.

Recherche clinique :

Prix et distinctions

      Industrial Research Chair (IRC), Natural Sciences and Engineering Research Council of Canada (NSERC), Canada

      Type de reconnaissance : Prize / Award (2019)

Publications

Journal Articles

  • Danovitch, David; Diop Mamadou; Drouin, Dominique; Paquet, Marie-Claude;. Void-Free Underfill Process With Variable Frequency Microwave for Higher Throughput in Large Flip Chip Package Application, Transactions on Device and Materials Reliability
    Submitted
  • Bélanger, Luc; Brouillette, G. P.; Danovitch, David; Gruber, Peter A.; Landreville, J. -L; Naugle, D. T.; Oberson, Valérie A.; Shih, Da-Yuan Y.; Tessler, C. L.; Turgeon, Michel R.. Low Cost Wafer Bumping, IBM Journal of Research and Development, 49 (4/5) (2005)
    Published

Propriétés intellectuelles

Patents

  • Multi-stack solder wafer filling, United States, Dépôt : 2012-06-04
    In Progress
  • Integrated Circuit Assembly, 8689437, United States, Dépôt : 2009-06-24, Délivrance : 2014-04-08
    Completed
  • SILICON CARRIER OPTOELECTRONIC PACKAGING, 8290008, United States, Délivrance : 2012-12-27
    Completed
  • Achieving mechanical and thermal stability in a multi-chip package, 8202765, United States, Délivrance : 2012-06-19
    Completed
  • Mold shave apparatus and injection molded soldering process, 8162199, United States, Délivrance : 2012-04-24
    Completed
  • Injection molded soldering process and arrangement for three-dimensional structures, 7952205, United States, Délivrance : 2011-05-31
    Completed
  • Injection molded soldering process and arrangement for three-dimensional structures, 7820483, United States, Délivrance : 2010-10-26
    Completed
  • Techniques for forming Interconnects, 7819376, United States, Délivrance : 2010-10-26
    Completed
  • Composite interconnect structure using injection molded solder technique, 7786588, United States, Délivrance : 2010-08-31
    Completed
  • Temporary structure to reduce stress and warpage in a flip chip organic package, 7538432, United States, Délivrance : 2009-05-26
    Completed
  • Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties, 7498198, United States, Délivrance : 2009-03-09
    Completed
  • Temporary structure to reduce stress and warpage in a flip chip organic package, 7473618, United States, Délivrance : 2009-01-06
    Completed

Disclosures

  • Laminate with Adhesive Layer for Temporary Attachment to a Low-expansion Material in Flip Chip Organic Package Manufacturing, Dépôt : 2008-07-09, Délivrance : 2010-01-20
    Disclosed
  • Method to Dice a Thinned Wafer Adhesively Bonded to a Glass Support, Dépôt : 2008-04-14, Délivrance : 2010-01-20
    Disclosed

Autres Contributions

Activités de collaboration internationale

  • Research collaborator, Collaboration on 3D Integration packaging process evaluation and development with IRT (CEA-LETI) (2015-01-01 au 2016-02-29)

Présentations

  • Le rôle du rework dans l’assemblage des systèmes d’Intégration Hétérogène en microéléctronique, Entretien Jacques Cartier, Bromont, Canada (2014-10-06)
  • Heterogeneous Integration in Microelectronics Packaging- Trends, Challenges & Opportunities, 2014 CMOS Emerging Technologies Research, Grenoble, France (2014-07-07)
  • Advanced Organic Substrate Impact on the Warpage with Variable Frequency Microwave Processing of Underfill, IMAPS 46th International Symposium on Microelectronics, Orlando, United States (2013-10-30)
  • Study of influential parameters for Lead-Free Flip chip solder joint cracking, European Microelectronics Packaging Conference, Grenoble, France (2013-09-12)
  • The Packaging Transition, from Afterthought to Enabler, 13th LETI Annual Review, Grenoble, France (2011-06-28)
  • Advanced Microelectronic Packaging- Trends, Challenges and Directions, Photonics North, Ottawa, Canada (2011-05-10)
  • l'Integration dans les systèmes embarqués hétérogènes- jusqu'a quel point?, FETCH 2011, Quebec City, Canada (2011-01-12)
  • Packaging Microélectronique- defies technologiques, Colloque LIA-LN2, Sacacomie, Canada (2010-07-12)
  • Materials in Advanced Microelectronic Packaging- Challenges & Trends, RQMP Grande Conférence sur les Materiaux de Pointe, Montréal, Canada (2010-05-14)
  • Advanced Packaging- The Ultimate Multi-technology Solution, ITAC SMC Best Practices Forum, Ottawa, Canada (2009-05-26)

Entrevues publiées

  • Patents at IBM Canada, Toronto Globe & Mail Report on Business (2013-03-16)

Les informations disponibles dans la base de données Expertus sont tirées du CV commun canadien.