Danovitch, David

Professeur sous octroi de recherche, Faculté de génie
FAC. GÉNIE Électrique et informatique

Coordonnées

Courriel


819-821-8000, poste 62129

Diplômes

(1982) Master's Thesis (Masters of Engineering). McGill University.

(1980) Bachelor's (Bachelor's of Engineering). McGill University.

Présentation

Sujets de recherche

Micro and Nanoelectronics.

Disciplines de recherche

Electrical Engineering and Electronic Engineering, Material Engineering and Metallurgic Engineering.

Mots-clés

flip chip soldering, microelectronics packaging.

Intérêts de recherche

Microelectronics packaging, materials for interconnections and encapsulations

Langues parlées et écrites

Anglais, Français

Prix et distinctions

  • (2019) Industrial Research Chair (IRC). Natural Sciences and Engineering Research Council of Canada (NSERC). (Prize / Award).

Publications

Articles de revue

  • Diop, Mamadous Drouin, Dominique Paquet, Marie-Claude. (2015). Void-Free Underfill Process With Variable Frequency Microwave for Higher Throughput in Large Flip Chip Package. IEEE Transactions on Device and Materials Reliability, 15(2), 250-257. (Published).

Articles de conférence

  • Marsan-Loyer, Catherine Boyer, Nicolas Danovitch, David. (2015). Addressing Fluxing Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnects. IEEE Electronic & Components Technology Conference. (Submitted).
  • Marsan-Loyer, Catherine Danovitch, David. (2015). Dippable Flux for 3D Packaging. 17th Canadian Semiconductor Science and Technology Conference. (Published).
  • Kanso, Malak Nguena, Elodie Danovitch, David. (2015). Ga Liquid Metal Embrittlement (LME) for Pb-free Solder Rework. 17th Canadian Semiconductor Science and Technology Conference. (Published).
  • Diop, Mamadou Drouin, Dominique Paquet, Marie-Claude. (2013). Advanced Organic Substrate Impact on the Warpage with Variable Frequency Microwave Processing of Underfill. IMAPS 46th International Symposium on Microelectronics. (Published).
  • Ayari-Kanoun, A. Danovitch, D. Drouin, D. Fontaine, R. Fortin, C. Oberson, V. Paquin, I. (2013). Study of influential parameters for Lead-Free Flip chip solder joint cracking. European Microelectronics Packaging Conference. (Published).
  • Danovitch, David Blais, Pascal Oberson, Valerie. (2009). Chip Joining High End Flip Chip Organic Packages- Interconnect Pitch Reduction Challenges. IMAPS Device Packaging Conference,. (Published).

Propriétés intellectuelles

Patents

  • (2014). Integrated Circuit Assembly. 8689437. (Completed).
  • (2012). SILICON CARRIER OPTOELECTRONIC PACKAGING. 8290008. (Completed).
  • (2012). Achieving mechanical and thermal stability in a multi-chip package. 8202765. (Completed).
  • (2012). Mold shave apparatus and injection molded soldering process. 8162199. (Completed).
  • (2011). Injection molded soldering process and arrangement for three-dimensional structures. 7952205. (Completed).
  • (2010). Injection molded soldering process and arrangement for three-dimensional structures. 7820483. (Completed).
  • (2010). Techniques for forming Interconnects. 7819376. (Completed).
  • (2010). Composite interconnect structure using injection molded solder technique. 7786588. (Completed).
  • (2009). Temporary structure to reduce stress and warpage in a flip chip organic package. 7538432. (Completed).
  • (2009). Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties. 7498198. (Completed).
  • (2009). Temporary structure to reduce stress and warpage in a flip chip organic package. 7473618. (Completed).
  • Multi-stack solder wafer filling. (In Progress).

Disclosures

Autres contributions

Activités de collaboration internationale

  • Research collaborator. (2015-2016). Collaboration on 3D Integration packaging process evaluation and development with IRT (CEA-LETI).

Présentations

  • (2015). Fine Pitch Assembly for 3D Integration- The Finer Points. IEEE Component Workshop on 2.5D/3D Packaging. Niskayuna.
  • (2015). Fine Pitch Assembly for 3D Integration- The Finer Points. LETI DAYS - IRT/C2MI and D43D workshop “Paradigms for 3D integration”,. Grenoble.
  • (2014). Le rôle du rework dans l’assemblage des systèmes d’Intégration Hétérogène en microéléctronique. Entretien Jacques Cartier. Bromont.
  • (2014). Heterogeneous Integration in Microelectronics Packaging- Trends, Challenges & Opportunities. 2014 CMOS Emerging Technologies Research. Grenoble.
  • (2013). Advanced Organic Substrate Impact on the Warpage with Variable Frequency Microwave Processing of Underfill. IMAPS 46th International Symposium on Microelectronics. Orlando.
  • (2013). Study of influential parameters for Lead-Free Flip chip solder joint cracking. European Microelectronics Packaging Conference. Grenoble.
  • (2011). The Packaging Transition, from Afterthought to Enabler. 13th LETI Annual Review. Grenoble.
  • (2011). Advanced Microelectronic Packaging- Trends, Challenges and Directions. Photonics North. Ottawa.
  • (2011). l'Integration dans les systèmes embarqués hétérogènes- jusqu'a quel point?. FETCH 2011. Quebec City.
  • (2010). Packaging Microélectronique- defies technologiques. Colloque LIA-LN2. Sacacomie.
  • (2010). Materials in Advanced Microelectronic Packaging- Challenges & Trends. RQMP Grande Conférence sur les Materiaux de Pointe. Montréal.
  • (2009). Advanced Packaging- The Ultimate Multi-technology Solution. ITAC SMC Best Practices Forum. Ottawa.

Les informations disponibles dans la base de données Expertus sont tirées du CV commun canadien.