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Alternative approaches to curing flip chip underfill encapsulants

Overview

RESEARCH DIRECTION
David Danovitch, Professeur - Department of Electrical and Computer Engineering
ADMINISTRATIVE UNIT(S)
Faculté de génie
Département de génie chimique et de génie biotechnologique
Département de génie électrique et de génie informatique
Département de génie mécanique
LEVEL(S)
Stage postdoctoral
LOCATION(S)
C2MI - Centre de Collaboration MiQro Innovation

Project Description

This project is focussed on photonic packaging improvements. Specifically, we seek to reduce the warpage of 'Photonic integrated circuits (PIC)' that are assembled onto these packages in order to optimize the performance and reliability of a multitude of fibers attached thereon. Such warpage is highly dependant on the encapsulant material (underfill) used to reinforce the flip chip interconnections of the PIC as well as its polymerisation (cure) protocol. We propose in this projet a study of alternative underfills and their cure protocols in order to reduce package stresses induced by these materials, thereby reducing PIC warpage. We also seek to investigate novel localised cure technologies to further reduce warpage.
The candidate will be responsible to survey recent materials proposed by leading underfill suppliers and selecting one or more candidates for assembly evaluation. In doing so, the candidate will develop cure protocols, including the study of alternative cure approaches, and will use a number of techniques for polymer and package characterisation.
The candidate will acquire a number of invaluable skills in this project, not only related to microelectronic packaging processes and structures, but also regarding industrial needs and practices, in that much of the research will be conducted in an industrial environment.
The candidate must possess the required prerequisites for admission to a post-doctoral internship program at the Université de Sherbrooke, and should have a strong interest in pursuing research in the field of microelectronic assembly and polymers (especially epoxy). Previous experience in microlectronic packaging, while not required, would be considered an asset, as would a practical knowledge of polymer characterisation (DSC, rheometry, FTIR, etc.) and assembly characterisation (acoustic microscopy, interferometry, SEM, etc.) techniques.
Finally, the candidate should possess means of transportation, as the majority of the work will take place at the C2MI research facilities in Bromont, Quebec.  The target start date of this project is September, 2022.


This project can accommodate one or more students in the following program:
- Postdoctoral fellowship

Discipline(s) by sector

Sciences naturelles et génie

Génie chimique, Génie électrique et génie électronique, Génie mécanique

Funding offered

Yes

Partner(s)

IBM Canada Ltée.

The last update was on 12 March 2024. The University reserves the right to modify its projects without notice.