Development of Polymer Hybrid Bonding Process for Fan-Out Wafer Level Packaging (FOWLP)

Project Description

Context:
Advanced packaging technologies are crucial for the evolution of microelectronics, enhancing performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Among these, Fan-Out Wafer Level Packaging (FOWLP) has emerged as a leading solution, particularly in applications where space efficiency and high interconnect density are critical. Polymer hybrid bonding represents a promising approach to enhance the capabilities of fan-out packaging by enabling superior bonding performance with reduced pitch, lower cost, and better reliability. This PhD project will focus on the development of a polymer-based hybrid bonding process for FOWLP, exploring the following key areas:

1. Polymer Selection & Material Properties: Investigating the properties of various polymers that could be used in hybrid bonding, for their mechanical, thermal, and electrical performance under the conditions of FOWLP applications.
2. Bonding Process Development: Examining advanced bonding processes for creating high-quality interconnects at the fan-out level, focusing on fine-pitch and heterogeneous multichip integration.
3. Process Scaling & Integration: Exploring the scalability of polymer hybrid bonding for large-scale manufacturing and its integration into existing FOWLP technologies.

Topic:
This thesis aims to to develop a robust polymer-based hybrid bonding technique as an innovative alternative to traditional inorganic dielectrics used in semiconductor packaging. The successful candidate will be responsible for: (i) conducting a literature review on polymers, particularly focusing on their use in hybrid bonding ; (ii) selecting 2-3 promising polymers based on their mechanical, thermal, and dielectric properties; (iii) developing the complete polymer-hybrid bonding process in the clean room, including surface preparation and applying the adhesive to the wafers; (iv) developing a die-to-wafer (D2W) bonding process tailored to achieve the desired packaging interface; (v) performing comprehensive morphological and mechanical characterizations to analyze the adhesion quality of the of the polymer-metal interface. At the end of this thesis, the student will have established an innovative polymer-based hybrid bonding process to improve integrity of advanced microelectronic systems.

Work Supervision:
This PhD thesis will be realized under the direction of Professor Dominique Drouin, as part of the IBM/NSERC Alliance Project on Multi-Chip Heterogeneous Integration for High Performance Computing. The work will be conducted primarily at the Interdisciplinary Institute for Technological Innovation (3IT) at the Université de Sherbrooke and at the MiQro Innovation Collaborative Center (C2MI) in Bromont. 3IT is a unique institute in Canada, specializing in the research and development of innovative technologies for energy, electronics, robotics and health. C2MI is an international center for collaboration and innovation in the MEMS and encapsulation field. It is the essential link between applied research and the marketing of microelectronics products. The student will thus benefit from an exceptional research environment that brings together students, professionals, professors and industry professionals working hand-in-hand to develop the technologies of the future.

Desired Profile:
• Master’s degree in micro-nanotechnologies or materials science.
• Skills in clean room microfabrication and electrical characterizations.
• Knowledge of polymer chemistry, and surface treatments is highly desirable.
• Ability to communicate effectively in English or French, both orally and in writing. 
• Strong capacity for adaptation, autonomy and teamwork.
• Pronounced taste for design, experimental work in a clean room, research, and development
• Assets: Knowledge of integration processes, and advanced microelectronic packaging.

Contact: inpaqt@usherbrooke.ca 
Documents to provide: Cover letter, curriculum vitae, transcripts for the past two years, and contact information for 2 references.

Funding offered

Yes

$ 25 000 CAD per year

Partner(s)

IBM Canada Ltée., Institut Interdisciplinaire d’Innovation Technologique (3IT), Centre de Collaboration MiQro Innovation (C2MI)

The last update was on 11 March 2025. The University reserves the right to modify its projects without notice.