Publications significatives

Récemment, une étude intitulée « Eternal Packages : Liquid Metal Flip Chip Devices » dont les co-auteurs sont Assane Ndieguene, Pierre Albert, Clément Fortin, Valérie Oberson et Julien Sylvestre, vient d’être primée à la conférence internationale IEEE Electronic Components and Technology Conference (ECTC) en obtenant le prix « Outstanding Oral Session Paper » 2016. Cette conférence est l'événement international le plus important dans le domaine du packaging avec plus de 1500 participants et plus de 350 papiers présentés. Elle est l’occasion de présenter les procédés les plus récents et innovants d’assemblage de composants et systèmes microélectroniques et optoélectroniques.

Quelques exemples de travaux publiés :

  • C. Bouchard, J. Sylvestre, “Highly Parallel Computations of Creep Deformation in Flip-Chip Interconnections”, 18th IEEEConference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, Germany, 2017.
  • T. Dequivre et al ., “Wet Metallization of High Aspect Ratio TSV Using Electrografted Polymer Insulator to Suppress Si Residual Stress Keep Out Zone”, IEEE Transactions on Device and Materials Reliability. In press. June 2017.
  • T. Dequivre et al., “Review—The Mediating Effect of Chemically Oxidized Silicon Surface on the P4VP Electrografting for Silicon Electrical Insulation”, ECS J. Solid State Sci. Technol., Vol. 6, n°5, 2017.
  • A. Cloutier et al., “Electrically Testing Non-Underfilled Flip chip Assemblies-Impacts on Interconnect Integrity”, 67th Electronic Components and Technology Conference (ECTC), Orlando, USA, 2017.
  • M. Kanso et al., “Fine Pitch Interconnect Rework for Lead-Free Flip Chip Packages”, 67th Electronic Components and Technology Conference (ECTC), Orlando, USA, 2017.
  • E. Nguena et al., “Ga Liquid Metal Embrittlement for Fine Pitch Interconnec.t Rework”, 67th Electronic Components and Technology Conference (ECTC), Orlando, USA, 2017.
  • T. Dequivre et al., “Electrografted P4VP for High Aspect Ratio Copper TSV Insulation in Via-Last Process Flow“, ECS J. Solid State Sci. Technol., Vol. 5, n°6, 2017.
  • A. Ndieguene et al.,“Polymer insulated Through Silicon Via (TSV) for advanced 3D packaging”, CSSTC 2017, Waterloo, Canada, 2017.
  • Z. Abboud et al., “Development of an Infrared Imager”, CSSTC 2017, Waterloo, Canada, 2017
  • A. Ndieguene et al., “Eternal Packages : Liquid Metal Flip Chip Devices, 66th Electronic Components and Technology Conference (ECTC), Las Vegas NV, USA, 2016.
  • E. Tetsi et al., “Ba1-xSrxTiO3 (x=0.4) nanoparticules self-assembling for 3D integration of decoupling capacitors on glass interposer », IEEE CPMT ESTC Conference, Grenoble, France, 2016.
  • P.M. Souare et al., “Thermal and mechanical analysis of a concentrated photovoltaic module with integrated secondary optics“, AIP Conference Proceedings, Vol. 1766, n°1, AIP Publishing, 2016.
  • X. Bernard X et al., “Heterogeneous Die-to-Die 3D Integration and Packaging Issues for Advanced Detectors in Radiation Instrumentation”, NSS/MIC, San Diego, USA, 2015.
  • T. Dequivre et al., “Electrografted P4VP as Dielectric in High Aspect Ratio TSV: Surface Preparation and Thermomechanical Consideration”, 228th ECS meeting, Phoenix, USA, 2015.
  • J. Sylvestre et al., “Modeling the flip-chip Wetting Process”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, n°12, 2014.
  • J. Sylvestre et al., “Large-scale model of flip-chip joining defects“, ASME 2014 International Mechanical Engineering Congress and Exposition, Montreal (Quebec), Canada, 2014.
  • L. Maurais et al.;“Impact of a 3D Microfabrication Process on the Dark Count Rate of Single Photon Avalanche Diodes”, NSS/MIC, Seattle, USA, 2014.
  • A. Ayari-Kanoun et al., “Study of influential parameters for lead-free flip-chip solder joint cracking“, IEEE European Microelectronics Packaging Conference (EMPC), 2013.