Packaging - Manufacturing - Modeling

The "Packaging - Manufacturing - Modeling" axis concerns research work related to the encapsulation of components and circuits developed in the other three areas of expertise of CRN2.

Keywords :
  • Packaging
  • TSV and 3D
  • Thermal management
  • Materials and processes
  • Manufacturing
  • Porous semiconductors
  • III-V semiconductors
  • Process integration
  • Modelization
  • Multiscale
  • Multiphysics
  • Bechou Laurent - Professor - Université de Bordeaux
  • Charlebois Serge - Professor, Université de Sherbrooke
  • Danovitch David - Professor, Université de Sherbrooke
  • Darnon Maxime - CNRS Researcher
  • Drouin Dominique - Professor, Université de Sherbrooke
  • Ecoffey Serge - Associate Professor, Université de Sherbrooke
  • Fréchette Luc - Professor, Université de Sherbrooke
  • Sylvestre Julien - Professor, Université de Sherbrooke
Students and professionals:
  • 1 research professional
  • 3 post-docs
  • 6 PhD students including 3 in cotutelle
Major projects :

Click on project's title to dowload the detailed description

Interconnection processes :
  • Deoxidation of interconnections solder by hydrogen-based reducing plasmas
  • Integration of passive components in interconnection materials and processes
  • Heterogeneous integration of nanoparticles to improve processes and integrity of interconnections
  • High density TSV technologies based on polymer insulation
  • Development and realization of reusable interconnection devices for quantum applications at ultra-cryogenic temperatures
  • Rework processes for thin-line interconnections
Encapsulation processes :
  • Improved adhesion and flow of underfill with plasma-based treatments
  • Optimization of underfill processes for larger or finer sized chips
  • Heterogeneous integration of nanoparticles in materials
Modeling :
  • Development of a virtual qualification system for packaging microsystems
  • Characterizations of failure physics
  • Virtual prototyping platform (web)
Development and applications of new materials :
  • Development of nanoparticle-based dielectric films for 3D electronics applications