Direct write lithography for fast prototyping

Manufacturer and model

Heidelberg Instruments - DWL66fs

Technical specifications
  • Source: Laser diode emitting at 405 nm
  • Maximum substrate diameter: 150mm
  • Active writing area: 140mm x 140mm
  • Placement accuracy: 50nm
  • Low resolution head: critical dimensions up to 2.5µm
  • High resolution head: critical dimensions up to 0.6µm
  • Compatible with CIF, GDSii, DXF and Gerber formats
 Examples of available processes
  • Direct write in photoresists AZ 1500, AZ nLof, SU-8 TF 6000, including two layers for lift-off processes

Log in to access technical documentation and contact info!