Polishing and planarization tool for insulating, semiconducting or metallic thin films.
Manufacturer and model
Alpsitec - E460
- Thicknesses of films from 20 nm to 2 μm
- Support for 4 "wafer, square samples of 10 x 10 and 22 x 22 mm2
- Acidic, basic or neutral polishing solutions with silica, alumina, or cerium
Examples of available processes
- Planarization of nanometric junctions for the manufacture of nanoelectronic devices of RRAM, SET, MIM type
- Planarization of metallic nanowires
- Polishing of Si₃N₄, SiO₂ to reduce surface roughness
- Planarization of gold microstructures
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