Emitech Sputter Coater

Equipment's role

Deposition of thin metallic films by a sputtering process using an argon plasma





Technical specifications

  • DC magnetron source operating at low voltage (100 to 150 V DC)
  • No cooling of the target or sample holder required (sample's temperature variation is below 10 ° C during the process)
  • Gold-Palladium Target (Au-Pd 60-40)
  • Process gas: Ar (0.35 mbar)
  • Sample size : small samples up to 6 cm diameter maximum

Examples of available processes

  • Metal deposits on non-conductive materials for SEM observation
  • Micro-fabrication of alignment marks for e-beam lithographic processes
  • Micro-fabrication of metallic grids in nanostructures