GLENBROOK TECHNOLOGIES 70T
Includes the "GTI-5000 Real-Time Image Workstation" software suite, which enables advanced automatic image analysis for BGA chips. The tool automatically detects/measures tin voids in balls, qualifies weld ball sphericity (BGA), as well as detects weld bridges.
The device has a 5-axis positioner (X, Y, Z, tilt and rotation) as well as a laser pointer for alignment.
Specifications
| Parameter | Value | Note |
|---|---|---|
Diameter of the spot at the focus | 10 µm |
|
Magnification | 7-2000x |
|
Interior dimensions | 28.5L*30P*23.75H |
|
Source anode voltage | 80 kV max. | adjustable |
Source anode current | 100 μA max. | adjustable |
Examples of use
Traces of copper on SI
Traces of copper on Si (close-up)
QFN inspection
