GLENBROOK TECHNOLOGIES 70T
Includes the "GTI-5000 Real-Time Image Workstation" software suite, which enables advanced automatic image analysis for BGA chips. The tool automatically detects/measures tin voids in balls, qualifies weld ball sphericity (BGA), as well as detects weld bridges.
The device has a 5-axis positioner (X, Y, Z, tilt and rotation) as well as a laser pointer for alignment.
Diameter of the spot at the focus
Source anode voltage
80 kV max.
Source anode current
100 μA max.