• Chip assembly (wirebonding, flipchip, thermocompression,...)
  • Assembly of surface mounted (smt) and through-hole (Thru hole) parts, on printed circuits boards (single or double sided)
  • Lead-free soldering
  • Laser Cutting and engraving on several materials
  • Defect Analysis by X-Ray
  • Integrated circuit design
  • Printed circuit board (pcb) design 
  • Embedded software design on FPGA
  • Equipment rental (oscilloscope, EmScan, ...)
  • Training on equipment accessible in our laboratories
  • Storage (freezer -40 ° C)

For more information or to talk to us about your specific needs, contact us via