• Chip assembly (wirebonding, flipchip, thermocompression,...)
• Assembly of surface mounted (smt) and through-hole (Thru hole) parts, on printed circuits boards (single or double sided)
• Lead-free soldering
• Laser Cutting and engraving on several materials
• Defect Analysis by X-Ray
• Integrated circuit design
• Printed circuit board (pcb) design 
• Embedded software design on FPGA
• Equipment rental (oscilloscope, EmScan, ...)
• Training on equipment accessible in our laboratories
• Storage (freezer -40 ° C)

For more information or to talk to us about your specific needs, contact us via InfoLCP@USherbrooke.ca