- Chip assembly (wirebonding, flipchip, thermocompression,...)
- Assembly of surface mounted (smt) and through-hole (Thru hole) parts, on printed circuits boards (single or double sided)
- Lead-free soldering
- Laser Cutting and engraving on several materials
- Defect Analysis by X-Ray
- Integrated circuit design
- Printed circuit board (pcb) design
- Embedded software design on FPGA
- Equipment rental (oscilloscope, EmScan, ...)
- Training on equipment accessible in our laboratories
- Storage (freezer -40 ° C)
For more information or to talk to us about your specific needs, contact us via InfoLCP@USherbrooke.ca