X-ray inspection system - GLENBROOK Technologies 70T
Includes the GTI-5000 Real-Time Image Workstation software suite, which enables advanced automatic image analysis for BGA chips. The tool automatically detects / measures tin voids in balls, qualifies the sphericality of the solder balls (BGA) and detects weld bridges.
The device has a 5-axis positioner (X, Y, Z, inclination and rotation) and a laser pointer for alignment.
Specifications
| Parameter | Value | Note |
|---|---|---|
| Focus spot diameter | 10 µm | |
| Zoom | 7-2000x | |
| Interior dimension | 28.5"L*30"P*23.75"H (723 mm*1095 mm*1631 mm) | |
| Anode voltage | 80 kV max | adjustable |
| Anode current | 100 µA max | adjustable |
Example
Copper trace on Silicon
Copper traces on Silicon (closer view)
QFN Inspection
