Wirebonding - DELVOTEC 5410

Manual and semi-automatic gold ball bonding system for bond-on-chip and chip-on-board (COB)

Thread tools

  • Can accomodate gold wires with a diamater from 17.5 to 50 µm

Working area

  • Y axis: 50 mm, Z axis: 50 mm; 2.5 µm / 1.25 µm resolution
  • Standard work height 136 mm (mid Z stroke)
  • X/Y manipulator from 5x5 mm to 18x18 mm